电迁移过程中BGA焊点动态电阻变化及其组织演化的尺寸效应研究
王玮, 冯佳运, 王帅, 王韬涵, 田茹玉, 田艳红
Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration
WANG Wei, FENG Jiayun, WANG Shuai, WANG Taohan, TIAN Ruyu, TIAN Yanhong
机械工程学报
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2026, (4): 126
-134
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DOI: 10.3901/JME.260111
