电迁移过程中BGA焊点动态电阻变化及其组织演化的尺寸效应研究

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机械工程学报 ›› 2026, Vol. 62 ›› Issue (4) : 126-134. DOI: 10.3901/JME.260111

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Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2026, 62(4): 126-134 https://doi.org/10.3901/JME.260111

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 62(4): 126-134 https://doi.org/10.3901/JME.260111

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