湿式机械化学磨削单晶硅的软磨料砂轮及其磨削性能

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机械工程学报 ›› 2023, Vol. 59 ›› Issue (3) : 328-336. DOI: 10.3901/JME.2023.03.328

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Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2023, 59(3): 328-336 https://doi.org/10.3901/JME.2023.03.328

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 59(3): 328-336 https://doi.org/10.3901/JME.2023.03.328

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