电子封装中Cu/Sn/Cu焊点组织演变及温度对IMC立体形貌影响

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焊接学报 ›› 2018, Vol. 39 ›› Issue (9) : 49-54. DOI: 10.12073/j.hjxb.2018390223

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Microstructural evolution of Cu/Sn/Cu joints and effect of temperature on three-dimensional morphology of IMCs in packaging technology

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2018, 39(9): 49-54 https://doi.org/10.12073/j.hjxb.2018390223

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 39(9): 49-54 https://doi.org/10.12073/j.hjxb.2018390223

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