埋入式基板微尺度球栅阵列焊点三点弯曲应力应变分析

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焊接学报 ›› 2018, Vol. 39 ›› Issue (8) : 23-27. DOI: 10.12073/j.hjxb.2018390194

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Stress and strain analysis of embedded substrate micro-scale ball grid array solder joint under three point bending

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2018, 39(8): 23-27 https://doi.org/10.12073/j.hjxb.2018390194

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 39(8): 23-27 https://doi.org/10.12073/j.hjxb.2018390194

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