Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces. The finite element simulation results were in good agreement with the experimental results.
[1] T Hara, Y Sato, R Higashino, et al. Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers. Applied Physics A, 2020, 126: 418. https://doi.org/10.1007/s00339-020-03559-6.
[2] Q Jiang, P Zhang, Z Yu, et al. A review on additive manufacturing of pure copper. Coatings, 2021, 11(6): 740.
[3] J Gao, X Luo, F Fang, et al. Fundamentals of atomic and close-to-atomic scale manufacturing: A review. International Journal of Extreme Manufacturing, 2022, 4(1): 012001.
[4] B Pan, R K Kang, J Guo, et al. Precision fabrication of thin copper substrate by double-sided lapping and chemical mechanical polishing. Journal of Manufacturing Processes, 2019, 44: 47-54.
[5] Z Lai, Z Hu, C Fang, et al. Research on factors affecting wear uniformity of the wheels in the double-sided lapping. Journal of Manufacturing Processes, 2020, 50(9): 653-662.
[6] X Liu, R Xiong, Z Xiong, et al. Simulation and experimental study on surface residual stress of ultra-precision turned 2024 aluminum alloy. Journal of the Brazilian Society of Mechanical Sciences and Engineering, 2020, 42(7): 1-7.
[7] S Gao, Z Dong, R Kang, et al. Warping of silicon wafers subjected to back-grinding process. Precision Engineering, 2015, 40: 87-93.
[8] Z Wang, J Sun, L Liu, et al. An analytical model to predict the machining deformation of frame parts caused by residual stress. Journal of Materials Processing Technology, 2019, 274: 116282
[9] X Huang, J Sun, J Li. Finite element simulation and experimental investigation on the residual stress-related monolithic component deformation. The International Journal of Advanced Manufacturing Technology, 2015, 77(5-8): 1035-1041.
[10] H Gao, Y Zhang, Q Wu, et al. An analytical model for predicting the machining deformation of a plate blank considers biaxial initial residual stresses. The International Journal of Advanced Manufacturing Technology, 2017, 93(1-4): 1473-1486.
[11] C Zhan, W Yang. A high efficient surface-based method for predicting part distortions in machining and shot peening. International Journal of Mechanical Sciences, 2016, 119: 125-143.
[12] S Masoudi, S Amini, E Saeidi, et al. Effect of machining-induced residual stress on the distortion of thin-walled parts. The International Journal of Advanced Manufacturing Technology, 2015, 76(1-4): 597-608.
[13] K A Young. Machining-induced residual stress and distortion of thin parts. Saint Louis: Washington University, 2005.
[14] H Gao, Y Zhang, Q Wu, et al. Investigation on influences of initial residual stress on thin-walled part machining deformation based on a semi-analytical model. Journal of Materials Processing Technology, 2018: S0924013618301444.
[15] S Nervi, B A Szabo, K A Young. Prediction of distortion of airframe components made from aluminum plates. AIAA Journal, 2009, 47(7): 1635-1641.
[16] X Cerutti, K Mocellin. Parallel finite element tool to predict distortion induced by initial residual stresses during machining of aeronautical parts. International Journal of Material Forming, 2015, 8(2): 255-268.
[17] X Cerutti, S Arsene, K Mocellin. Prediction of machining quality due to the initial residual stress redistribution of aerospace structural parts made of low-density aluminium alloy rolled plates. Journal of Material Forming, 2016, 9(5): 677-690.
[18] S Zhang. Research on ultra-precision processing of pure copper sheet with large diameter-thickness ratio. Hangzhou: Zhejiang University of Technology, 2019. (in Chinese)
[19] S Y Yang, J H Kim. Computation of stress field during additive manufacturing by explicit finite element method. Journal of Korean Powder Metallurgy Institute, 2020, 27(4): 318-324.
[20] C G Yao, Z B An, Z F Yang. Residual stress distributions of laser additive manufactured inconel 718 alloy and its numerical simulation and analysis. Machine Building & Automation, 2019(4): 134-136, 179. (in Chinese)
[21] J Guo, H Fu, B Pan, et al. Recent progress of residual stress measurement methods: A review. Chinese Journal of Aeronautics, 2021, 34(2): 54-78.
[22] Q Wu, N P Xue, Y D Zhang, et al. A prediction model of the extrusion deformation with residual stress on 6063 aluminum alloy aeronautical plate considering different extrusion parameters. International Journal of Advanced Manufacturing Technology, 2020, 107(3-4): 1-11.
[23] Q Bai, H Feng, L K Si, et al. A novel stress relaxation modeling for predicting the change of residual stress during annealing heat treatment. Metallurgical and Materials Transactions A, 2019, 50(12): 5750-5759.
[24] C Sun, S Xiu, Y Hong, et al. Prediction on residual stress with mechanical-thermal and transformation coupled in DGH. International Journal of Mechanical Sciences, 2020: 105629.
[25] L Yang, D Xu, M Agmell, et al. Investigation on residual stress evolution in nickel-based alloy affected by multiple cutting operations. Journal of Manufacturing Processes, 2021, 68: 818-833.
[26] H Chen, J Zhao, Z Wang, et al. Modeling virtual abrasive grain based on random ellipsoid tangent plane. The International Journal of Advanced Manufacturing Technology, 2021, 113(7): 2049-2064.
[27] S M Afazov, A A Becker, T H Hyde. Mathematical modeling and implementation of residual stress mapping from microscale to macroscale finite element models. Journal of Manufacturing Science and Engineering, 2012, 134(2).
[28] S M Ratchev, S M Afazov, A A Becker, et al. Mathematical modelling and integration of micro-scale residual stresses into axisymmetric FE models of Ti6Al4V alloy in turning. CIRP Journal of Manufacturing Science and Technology, 2011, 4(1): 80-89.
[29] Y Hashimoto, T Sano, T Furumoto, et al. Development an identification method of friction coefficient between wafer and carrier in double-sided lapping. Precision Engineering, 2019, 56: 364-369.
[30] B Lin, X M Jiang, S P Li, et al. Mechanism of material removal by fixed abrasive lapping of fused quartz glass. Journal of Manufacturing Processes, 2019, 46: 279-285.
[31] T Kasai. Akinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP). Tribology International, 2008, 41(2): 111-118.
