Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Jiang Guo, Zengxu He, Bo Pan, Bin Wang, Qian Bai, Jinxing Kong, Renke Kang

Chinese Journal of Mechanical Engineering ›› 2023, Vol. 36 ›› Issue (1) : 15-15.

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Chinese Journal of Mechanical Engineering ›› 2023, Vol. 36 ›› Issue (1) : 15-15. DOI: 10.1186/s10033-022-00824-y
2023-02-25

Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 36(1): 15-15 https://doi.org/10.1186/s10033-022-00824-y

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