Bonding mechanisms of SiO2 glass and 1060 Al by ultrasonic assisted active metal soldering process

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中国焊接 ›› 2023, Vol. 32 ›› Issue (2) : 52-62. DOI: 10.12073/j.cw.20230308001

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Bonding mechanisms of SiO₂ glass and 1060 Al by ultrasonic assisted active metal soldering process

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Bonding mechanisms of SiO₂ glass and 1060 Al by ultrasonic assisted active metal soldering process

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2023, 32(2): 52-62 https://doi.org/10.12073/j.cw.20230308001

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 32(2): 52-62 https://doi.org/10.12073/j.cw.20230308001

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