Fluxless bonding with silver nanowires aerogel in die-attached interconnection

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中国焊接 ›› 2023, Vol. 32 ›› Issue (2) : 32-41. DOI: 10.12073/j.cw.20230227001

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Fluxless bonding with silver nanowires aerogel in die-attached interconnection

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2023, 32(2): 32-41 https://doi.org/10.12073/j.cw.20230227001

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 32(2): 32-41 https://doi.org/10.12073/j.cw.20230227001

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