Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes

刘昊, 马瑞, 赵丁伟, 崔志远, 张微微, 王建强

中国焊接 ›› 2022, Vol. 31 ›› Issue (2) : 23-28.

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中国焊接 ›› 2022, Vol. 31 ›› Issue (2) : 23-28. DOI: 10.12073/j.cw.20211228001

Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes

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Application of silver nanoparticles in electrically conductive adhesives with silver micro flakes

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2022, 31(2): 23-28 https://doi.org/10.12073/j.cw.20211228001
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 31(2): 23-28 https://doi.org/10.12073/j.cw.20211228001
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