Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints

操慧珺, 李世钦, 张英干, 朱轶辰, 李明雨, 张志昊

中国焊接 ›› 2022, Vol. 31 ›› Issue (1) : 47-59.

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中国焊接 ›› 2022, Vol. 31 ›› Issue (1) : 47-59. DOI: 10.12073/j.cw.20211209001

Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints

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Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2022, 31(1): 47-59 https://doi.org/10.12073/j.cw.20211209001
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 31(1): 47-59 https://doi.org/10.12073/j.cw.20211209001
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