Numerical simulation of thermal field of FSW 2219 aluminum alloy thick plate

卢晓红, 孙旭东, 孙世煊, 钱俊瑜, Steven Y. Liang

中国焊接 ›› 2021, Vol. 30 ›› Issue (4) : 1-8.

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中国焊接 ›› 2021, Vol. 30 ›› Issue (4) : 1-8. DOI: 10.12073/j.cw.20211103001

Numerical simulation of thermal field of FSW 2219 aluminum alloy thick plate

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Numerical simulation of thermal field of FSW 2219 aluminum alloy thick plate

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2021, 30(4): 1-8 https://doi.org/10.12073/j.cw.20211103001
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 30(4): 1-8 https://doi.org/10.12073/j.cw.20211103001
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