电流辅助成形技术研究进展及展望

doi:10.3969/j.issn.1007-2012.2023.06.005

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塑性工程学报 ›› 2023, Vol. 30 ›› Issue (6) : 58-66. DOI: 10.3969/j.issn.1007-2012.2023.06.005

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特种能场辅助成形

电流辅助成形技术研究进展及展望

徐勋虎^1,2, 康庆鑫^1,2, 刘永康³, 王春旭^1,2, 王国峰^1,2

作者信息 +

Research progress and prospect of current-assisted forming technology

XU Xun-hu^1,2, KANG Qing-xin^1,2, LIU Yong-kang³, WANG Chun-xu^1,2, WANG Guo-feng^1,2

Author information +

文章历史 +

摘要

超塑成形/扩散连接(SPF/DB)工艺是指在一个热循环内材料同时完成成形和扩散连接的加工过程。随着航空航天领域对轻质高强难变形金属材料需求增加，迫切需要探索这类材料的成形新方法。电流辅助成形能够降低材料流动应力，提高其成形精度，与SPF/DB工艺相结合能够高效制备复杂结构件，这对高强难变形金属材料成形具有重要意义。介绍了电致塑性原理，梳理了电流辅助成形、扩散连接和SPF/DB的特点与优势，阐述了目前电流辅助成形工艺面临的挑战与展望。

Abstract

Superplastic forming/diffusion bonding (SPF/DB)technology is the process of accomplishing forming and diffusion bonding simultaneously in one thermal cycle of material. With the increasing demand for lightweight and difficult-to-deformation metal materials with high strength in aerospace field,it is urgent to explore new methods for forming these materials. Current-assisted forming can reduce the flow stress of material and improve its forming accuracy. The combination of current-assisted forming and SPF/DB process can efficiently prepare complex structural parts,which is of great significance forming difficult-to-deformation metal materials with high strength. The principle of electroplasticity was introduced,the characteristics and advantages of current-assisted forming,diffusion bonding and SPF/DB were summarized,and the challenges and prospects of current-assisted forming technology were expounded.

导出引用

徐勋虎, 康庆鑫, 刘永康, 王春旭, 王国峰. 电流辅助成形技术研究进展及展望[J]. 塑性工程学报, 2023, 30(6): 58-66 https://doi.org/10.3969/j.issn.1007-2012.2023.06.005

XU Xun-hu, KANG Qing-xin, LIU Yong-kang, WANG Chun-xu, WANG Guo-feng. Research progress and prospect of current-assisted forming technology[J]. Journal of Plasticity Engineering, 2023, 30(6): 58-66 https://doi.org/10.3969/j.issn.1007-2012.2023.06.005

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