To explore the mechanism of silicon nitride cutting with single grain, simulation and experimental are carried out on silicon nitride cutting with single diamond grain. Choosing truncated octahedron to simulate diamond grain, based on the Johnson-Holmquist ceramic brittle material constitutive model, the single grain linear cutting simulation is modeled by finite element method. The phenomena is analyzed for workpiece material chips, scratches morphology, stress changes and distribution, and cutting forces changes, and the effect of process parameters on the cutting force is studied. With the preparation of single diamond grain tools, the silicon nitride cutting experiments are carried on surface grinding machine with cutting depth changing, to further analyze the changes of scratches morphology and cutting forces, and verify the correctness of finite element simulation. The results show that the scratches are direct and brightness, little plastic ridges, with the larger size of broken edge and small partially broken; the scratch depth and width are slightly larger than the grain cutting depth and width. Fluctuations are existed in stress and cutting force. As the wheel speed increases, the tangential force and normal force reduce; cutting depth increases, the tangential force and normal force increase. The cutting force ratio is changing between 4 and 6.
LIU Wei
,
DENG Zhaohui
,
WAN Linlin
,
ZHAO Xiaoyu
,
PI Zhou
. Simulation and Experiment Study for Silicon Nitride Cutting with Single Diamond Grain[J]. Journal of Mechanical Engineering, 2015
, 51(21)
: 191
-198
.
DOI: 10.3901/JME.2015.21.191
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