Development Status and Perspective Trend of Ultra-thin Micro Heat Pipe

TANG Yong; TANG Heng; WAN Zhenping; YUAN Wei; LU Longsheng; LI Zongtao

doi:10.3901/JME.2017.20.131

Journal of Mechanical Engineering >

2017 , Vol. 53 >Issue 20: 131 - 144

DOI: https://doi.org/10.3901/JME.2017.20.131

Development Status and Perspective Trend of Ultra-thin Micro Heat Pipe

TANG Yong ,
TANG Heng ,
WAN Zhenping ,
YUAN Wei ,
LU Longsheng ,
LI Zongtao

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1. School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640;
2. Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, Guangzhou 510640

Received date: 2016-09-08

Revised date: 2017-02-20

Online published: 2017-10-20

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Abstract

The rapid increase of heat generation level has become a major technical challenge in the development and applications of contemporary advanced microelectronic chip system. As an efficient heat transfer device, micro heat pipes have been widely used for thermal management of electronic devices because of their excellent thermal performance and high reliability. However, with electronic devices becoming highly integrated, lighter, and thinner, traditional micro heat pipes cannot meet the usage requirement. An ultra-thin micro heat pipe has been proposed and has become the research focus of modern heat pipe technology. The types and applications of ultra-thin micro heat pipe are introduced, as well as the research progresses of wick structure and forming process of ultra-thin micro heat pipe are summarized. Furthermore, the problems existed on ultra-thin micro heat pipe technology are pointed out and it is also suggested that more efforts should be made to what in the future.

Key words： ultra-thin micro heat pipe; wick structure; heat dissipation

Cite this article

TANG Yong , TANG Heng , WAN Zhenping , YUAN Wei , LU Longsheng , LI Zongtao . Development Status and Perspective Trend of Ultra-thin Micro Heat Pipe[J]. Journal of Mechanical Engineering, 2017 , 53(20) : 131 -144 . DOI: 10.3901/JME.2017.20.131

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