Ultrasonic assisted grinding (UAG) shows great advantages on the machining of hard and brittle materials. To enhance the application of UAG, it is important to investigate its basic mechanism. A single diamond tool is used to conduct ultrasonic assisted scratching (UAS) tests for the purpose of imitating the material removal behavior of a single grain on the grinding wheel. The nominal and tangential scratching forces are compared under different ultrasonic amplitudes. The topographical characteristics are analyzed, including the width, depth and cross section area of the scratched grooves. The influence of ultrasonic vibration on the material removal behavior is discussed based on the scratching force, topographical characteristics and tool wear. It is observed that the scratching force significantly descended while the material removal significantly ascended with the help of ultrasonic vibration. The high-frequency impact and the intermittent energy input are considered the cause of observed UAS features.
ZHENG Feifei
,
DONG Zhigang
,
ZHANG Jiatong
,
LIU Jinting
,
KANG Renke
. Influence of Ultrasonic Vibration on Material Removal of Scratching on RB-SiC with Single Diamond Tool[J]. Journal of Mechanical Engineering, 2019
, 55(1)
: 225
-232
.
DOI: 10.3901/JME.2019.01.225
[1] 王健. RBSiC超声辅助磨削工艺研究[D]. 大连:大连理工大学,2015. WANG Jian. Study on the ultrasonic assisted grinding process of RBSiC[D]. Dalian:Dalian University of Technology,2015.
[2] XIAO X,ZHENG K,LIAO W,et al. Study on cutting force model in ultrasonic vibration assisted side grinding of zirconia ceramics[J]. International Journal of Machine Tools and Manufacture,2016,104:58-67.
[3] CHEN J,FANG Q,LI P. Effect of grinding wheel spindle vibration on surface roughness and subsurface damage in brittle material grinding[J]. International Journal of Machine Tools and Manufacture,2015,91:12-23.
[4] 梁志强,王西彬,吴勇波,等. 超声振动辅助磨削技术的现状与新进展[J]. 兵工学报,2010(11):1530-1535. LIANG Zhiqiang,WANG Xibin,WU Yongbo,et al. Status and progress of ultrasonic assisted grinding technique[J]. Acta Armamentarii,2010(11):1530-1535.
[5] 张洪丽. 超声振动辅助磨削技术及机理研究[D]. 济南:山东大学,2007. ZHANG Hongli. Study on the technology and mechanism of ultrasonic vibration assisted grinding[D].Jinan:Shandong University,2007.
[6] SHEN J Y,WANG J Q,JIANG B,et al. Study on wear of diamond wheel in ultrasonic vibration-assisted grinding ceramic[J]. Wear,2015,332-333:788-793.
[7] 康仁科,马付建,董志刚,等. 难加工材料超声辅助切削加工技术[J]. 航空制造技术. 2012(16):44-49. KANG Renke,MA Fujian,DONG Zhigang,el al. Ultrasonic assisted machining of difficult-to-cut material[J]. Aviation Manufacturing Technology,2012(16):44-49.
[8] 苏阔. 铝基碳化硅复合材料的超声辅助磨削加工工艺研究[D]. 大连:大连理工大学,2012. SU Kuo. Study on the ultrasonic assisted grinding processing technology of SiCp/Al composite[D]. Dalian:Dalian University of Technology,2012.
[9] 刘立飞,张飞虎,刘民慧. 碳化硅陶瓷的超声振动辅助磨削[J]. 光学精密工程,2015(8):2229-2235. LIU Lifei,ZHANG feihu,LIU Minhui. Ultrasonic assisted grinding for silicon carbide[J]. Optics and Precision Engineering,2015(8):2229-2235.
[10] 马付建. 超声辅助加工系统研发及其在复合材料加工中的应用[D]. 大连:大连理工大学,2013. MA Fujian. The development of ultrasonic assisted machining system and its application in machining of composite[D]. Dalian:Dalian University of Technology,2013.
[11] QIN N,PEI Z J,TREADWELL C,et al. Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling[J]. Journal of Manufacturing Science and Engineering-Transactions of the ASME,2009,131:0410114.
[12] PEI Z J,FERREIRA P M. Modeling of ductile-mode material removal in rotary ultrasonic machining[J]. International Journal of Machine Tools and Manufacture,1998,38(10):1399-1418.
[13] CONG W L,PEI Z J,SUN X,et al. Rotary ultrasonic machining of CFRP:A mechanistic predictive model for cutting force[J]. Ultrasonics,2014,54(2):663-675.
[14] ZHANG C,ZHANG J,FENG P. Mathematical model for cutting force in rotary ultrasonic face milling of brittle materials[J]. The International Journal of Advanced Manufacturing Technology,2013,69(1-4):161-170.
[15] 周晓勤,梁桂强,郭婷婷. 铝基碳化硅复合材料超声振动辅助划痕表面形貌研究[J]. 功能材料,2014(23):23131-23133. ZHOU Xiaoqin,LIANG Guiqiang,GUO Tingting. Ultrasonic vibration assisted scratch surface morphology of silicon carbide particle reinforced aluminium matrix composites[J]. Functional Materials,2014(23):23131-23133.
[16] FENG P,LIANG G,ZHANG J. Ultrasonic vibration-assisted scratch characteristics of silicon carbide-reinforced aluminum matrix composites[J]. Ceramics International. 2014,40(7):10817-10823.
[17] ZHANG C,FENG P,ZHANG J. Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter[J]. International Journal of Machine Tools and Manufacture,2013,64:38-48.
[18] CAO J,WU Y,LU D,et al. Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool[J]. International Journal of Machine Tools and Manufacture,2014,79:49-61.
[19] ZHOU M,ZHAO P. Prediction of critical cutting depth for ductile-brittle transition in ultrasonic vibration assisted grinding of optical glasses[J]. The International Journal of Advanced Manufacturing Technology,2016,86:1775-1784.
[20] FENG P,LIANG G,ZHANG J. Ultrasonic vibration-assisted scratch characteristics of silicon carbide-reinforced aluminum matrix composites[J]. Ceramics International,2014,40(7):10817-10823.
[21] ZHANG F,MENG B,GENG Y,et al. Friction behavior in nanoscratching of reaction bonded silicon carbide ceramic with Berkovich and sphere indenters[J]. Tribology International,2016,97:21-30.
[22] ZHENG F F,MA F J,WANG Y D,et al. The influence of amplitude on grinding force and surface roughness in ultrasonic assisted grinding of K9 glass[J]. Advanced Materials Research,2014,1017:741-746.
[23] CAO J,WU Y,LU D,et al. Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool[J]. International Journal of Machine Tools and Manufacture,2014,79:49-61.
[24] SUYAMA S,KAMEDA T,ITOH Y. Development of high-strength reaction-sintered silicon carbide[J]. Diamond and Related Materials,2003,12(3-7):1201-1204.
[25] YAN J,ZHANG Z,KURIYAGAWA T. Mechanism for material removal in diamond turning of reaction-bonded silicon carbide[J]. International Journal of Machine Tools and Manufacture,2009,49(5):366-374.
