Simulation Study on Moisture Diffusion Behavior of PBGA Devices under Hygrothermal Coupling Conditions

ZHANG Yunxuan, WANG Shang, SA Zicheng, WEN Jiayue, XU Shimeng, LIN Pengrong, CHEN Linfeng, TIAN Yanhong

Journal of Mechanical Engineering ›› 2026, Vol. 62 ›› Issue (10) : 137-145.

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Journal of Mechanical Engineering ›› 2026, Vol. 62 ›› Issue (10) : 137-145. DOI: 10.3901/JME.260497

Simulation Study on Moisture Diffusion Behavior of PBGA Devices under Hygrothermal Coupling Conditions

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 62(10): 137-145 https://doi.org/10.3901/JME.260497

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