Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration

WANG Wei, FENG Jiayun, WANG Shuai, WANG Taohan, TIAN Ruyu, TIAN Yanhong

Journal of Mechanical Engineering ›› 2026, Vol. 62 ›› Issue (4) : 126-134.

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Journal of Mechanical Engineering ›› 2026, Vol. 62 ›› Issue (4) : 126-134. DOI: 10.3901/JME.260111

Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 62(4): 126-134 https://doi.org/10.3901/JME.260111

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