Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding

ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong

Journal of Mechanical Engineering ›› 2023, Vol. 59 ›› Issue (3) : 328-336.

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Journal of Mechanical Engineering ›› 2023, Vol. 59 ›› Issue (3) : 328-336. DOI: 10.3901/JME.2023.03.328

Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 59(3): 328-336 https://doi.org/10.3901/JME.2023.03.328

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