Drilling of Heterogeneous Multi-layer Printed Circuit Boards: A review

HUANG Xin, WANG Chengyong, HE Yuxing, FANG Gexian, YANG Tao, YAO Junxiong, ZHENG Lijuan

Journal of Mechanical Engineering ›› 2023, Vol. 59 ›› Issue (3) : 283-307.

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Journal of Mechanical Engineering ›› 2023, Vol. 59 ›› Issue (3) : 283-307. DOI: 10.3901/JME.2023.03.283

Drilling of Heterogeneous Multi-layer Printed Circuit Boards: A review

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 59(3): 283-307 https://doi.org/10.3901/JME.2023.03.283

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