Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging

GAO Liyin, LI Caifu, LIU Zhiquan, SUN Rong

Journal of Mechanical Engineering ›› 2022, Vol. 58 ›› Issue (2) : 185-202.

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Journal of Mechanical Engineering ›› 2022, Vol. 58 ›› Issue (2) : 185-202. DOI: 10.3901/JME.2022.02.185

Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 58(2): 185-202 https://doi.org/10.3901/JME.2022.02.185

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