Study on Ultrafine Wire Bonding and Performance of Radio Frequency Devices

WANG Shang, WANG Kaifeng, ZHANG He, XU Jiahui, YANG Dongsheng, HANG Chunjin, TIAN Yanhong

Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (22) : 201-208.

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Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (22) : 201-208. DOI: 10.3901/JME.2021.22.201

Study on Ultrafine Wire Bonding and Performance of Radio Frequency Devices

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 57(22): 201-208 https://doi.org/10.3901/JME.2021.22.201

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