Method for Simultaneously Sensing the Internal Temperature Field and Thickness of Solid Structure under Steady Heat Conduction Condition

HU Bin, WEI Dong, SHI Youan, SHOU Binan, GUI Yewei

Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (4) : 21-26.

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Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (4) : 21-26. DOI: 10.3901/JME.2021.04.021

Method for Simultaneously Sensing the Internal Temperature Field and Thickness of Solid Structure under Steady Heat Conduction Condition

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 57(4): 21-26 https://doi.org/10.3901/JME.2021.04.021

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