Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints

ZHAO Shengjun, HUANG Chunyue, LIANG Ying, KUANG Bing, TANG Xiangqiong

Journal of Mechanical Engineering ›› 2020, Vol. 56 ›› Issue (10) : 86-94.

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Journal of Mechanical Engineering ›› 2020, Vol. 56 ›› Issue (10) : 86-94. DOI: 10.3901/JME.2020.10.086

Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 56(10): 86-94 https://doi.org/10.3901/JME.2020.10.086

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