Rapid Sintering of Nano Copper-Silver Core-Shell Paste and Interconnection of Copper Substrates by Pulse Current

HUANG Yuan, HANG Chunjin, TIAN Yanhong, WANG Chenxi, ZHANG He

Journal of Mechanical Engineering ›› 2019, Vol. 55 ›› Issue (24) : 51-56.

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Journal of Mechanical Engineering ›› 2019, Vol. 55 ›› Issue (24) : 51-56. DOI: 10.3901/JME.2019.24.051

Rapid Sintering of Nano Copper-Silver Core-Shell Paste and Interconnection of Copper Substrates by Pulse Current

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 55(24): 51-56 https://doi.org/10.3901/JME.2019.24.051

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