In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits

ZHU Weijun, CHEN Yankun, ZHANG Zhikun, TIAN Xiaoyong, LI Dichen

Journal of Mechanical Engineering ›› 2019, Vol. 55 ›› Issue (15) : 64-70.

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Journal of Mechanical Engineering ›› 2019, Vol. 55 ›› Issue (15) : 64-70. DOI: 10.3901/JME.2019.15.064

In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 55(15): 64-70 https://doi.org/10.3901/JME.2019.15.064

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