Material Removal Behavior in Ultrasonic Assisted Grinding of SiC Ceramics

CAO Jianguo, ZHANG Qinjian

Journal of Mechanical Engineering ›› 2019, Vol. 55 ›› Issue (13) : 205-211.

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Journal of Mechanical Engineering ›› 2019, Vol. 55 ›› Issue (13) : 205-211. DOI: 10.3901/JME.2019.13.205

Material Removal Behavior in Ultrasonic Assisted Grinding of SiC Ceramics

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 55(13): 205-211 https://doi.org/10.3901/JME.2019.13.205

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