Study on Rapid Solidification Microstructure and Electrical Property of Co-Cu-Pb Ternary Alloy

GAO Ka, GUO Xiaoqin, ZHANG Rui

Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (18) : 99-105.

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Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (18) : 99-105. DOI: 10.3901/JME.2017.18.099

Study on Rapid Solidification Microstructure and Electrical Property of Co-Cu-Pb Ternary Alloy

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 53(18): 99-105 https://doi.org/10.3901/JME.2017.18.099

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