The Disassembly Model and Its Analysis of PCB by Vibration

XIANG Dong, WU Yujia, YANG Jiping, LONG Danfeng, MOU Peng

Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (9) : 127-134.

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Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (9) : 127-134. DOI: 10.3901/JME.2017.09.127

The Disassembly Model and Its Analysis of PCB by Vibration

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 53(9): 127-134 https://doi.org/10.3901/JME.2017.09.127

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