Progress and Application of Key Technologies on the Electronic Packaging Equipment Development

CHEN Xin, JIANG Yongjun, TAN Yutao, GAO Jian, YANG Zhijun, LIU Guanfeng, HE Yunbo, WANG Han, LI Zexiang

Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (5) : 181-189.

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Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (5) : 181-189. DOI: 10.3901/JME.2017.05.181

Progress and Application of Key Technologies on the Electronic Packaging Equipment Development

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 53(5): 181-189 https://doi.org/10.3901/JME.2017.05.181

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