Rapidly Sintering of Nano Copper Paste and Interconnection of Copper and Nickel Substrate by Pulse Current

HUANG Yuan, TIAN Yanhong, JIANG Zhi, WANG Chenxi

Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (4) : 34-42.

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Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (4) : 34-42. DOI: 10.3901/JME.2017.04.034
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Rapidly Sintering of Nano Copper Paste and Interconnection of Copper and Nickel Substrate by Pulse Current

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 53(4): 34-42 https://doi.org/10.3901/JME.2017.04.034

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