Effect of Bi and Ni Concentration on the Creep Behavior of the Bulks of Cu/SAC/Cu Micro Solder Joints

KONG Xiangxia, SUN Fenglian, YANG Miaosen, LIU Yang

Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (2) : 53-60.

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Journal of Mechanical Engineering ›› 2017, Vol. 53 ›› Issue (2) : 53-60. DOI: 10.3901/JME.2017.02.053

Effect of Bi and Ni Concentration on the Creep Behavior of the Bulks of Cu/SAC/Cu Micro Solder Joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2017, 53(2): 53-60 https://doi.org/10.3901/JME.2017.02.053

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