Research on Fatigue Properties of Micron Scale Copper Bonding Wires

ZHAO Shuang, ZHAO Zihua, LEI Ming, YE Heng, QI Fengcai

Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (18) : 70-76.

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Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (18) : 70-76. DOI: 10.3901/JME.2016.18.070

Research on Fatigue Properties of Micron Scale Copper Bonding Wires

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 52(18): 70-76 https://doi.org/10.3901/JME.2016.18.070

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