Model of Grain Depth of Cut in Wafer Rotation Grinding Method for Silicon Wafers

GAO Shang, WANG Ziguang, KANG Renke, DONG Zhigang, ZHANG Bi

Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (17) : 86-93.

Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (17) : 86-93. DOI: 10.3901/JME.2016.17.086

Model of Grain Depth of Cut in Wafer Rotation Grinding Method for Silicon Wafers

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 52(17): 86-93 https://doi.org/10.3901/JME.2016.17.086

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