Mechanical Performance and Fracture Behavior of Microscale Cu/Sn-3.0Ag-0.5Cu/Cu Joints under Electro-tensile Coupled Loads

LI Wangyun, QIN Hongbo, ZHOU Minbo, ZHANG Xinping

Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (10) : 46-53.

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Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (10) : 46-53. DOI: 10.3901/JME.2016.10.046

Mechanical Performance and Fracture Behavior of Microscale Cu/Sn-3.0Ag-0.5Cu/Cu Joints under Electro-tensile Coupled Loads

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 52(10): 46-53 https://doi.org/10.3901/JME.2016.10.046

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