Research on Defects Inspection of Solder Bumps Using Active Infrared Thermography Technology

LU Xiangning, HE Zhenzhi, HU Ningning, SU Lei, NIE Lei

Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (10) : 17-24.

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Journal of Mechanical Engineering ›› 2016, Vol. 52 ›› Issue (10) : 17-24. DOI: 10.3901/JME.2016.10.017

Research on Defects Inspection of Solder Bumps Using Active Infrared Thermography Technology

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2016, 52(10): 17-24 https://doi.org/10.3901/JME.2016.10.017

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