Analysis and Modeling Cutting Force for SiC Monocrystal Wafer Processing

LI Shujuan,LIU Yong,HOU Xiaoli,GAO Xinqin

Journal of Mechanical Engineering ›› 2015, Vol. 51 ›› Issue (23) : 189-195.

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Journal of Mechanical Engineering ›› 2015, Vol. 51 ›› Issue (23) : 189-195. DOI: 10.3901/JME.2015.23.189

Analysis and Modeling Cutting Force for SiC Monocrystal Wafer Processing

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2015, 51(23): 189-195 https://doi.org/10.3901/JME.2015.23.189

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