Molecular Dynamics Simulation of Thermal Conductivity of Primary Particle of Silica Aerogel

SU Gaohui; YANG Zichun; SUN Fengrui

Journal of Mechanical Engineering ›› 2014, Vol. 50 ›› Issue (22) : 178-185.

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Journal of Mechanical Engineering ›› 2014, Vol. 50 ›› Issue (22) : 178-185. DOI: 10.3901/JME.2014.22.178
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Molecular Dynamics Simulation of Thermal Conductivity of Primary Particle of Silica Aerogel

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 50(22): 178-185 https://doi.org/10.3901/JME.2014.22.178

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