Research on Low Cycle Fatigue Behavior of BGA Structure Lead-free Solder Joints

QIN Hongbo; LI Wangyun; LI Xunping; ZHANG Xinping

Journal of Mechanical Engineering ›› 2014, Vol. 50 ›› Issue (20) : 54-62.

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Journal of Mechanical Engineering ›› 2014, Vol. 50 ›› Issue (20) : 54-62. DOI: 10.3901/JME.2014.20.054
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Research on Low Cycle Fatigue Behavior of BGA Structure Lead-free Solder Joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 50(20): 54-62 https://doi.org/10.3901/JME.2014.20.054

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