电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展

电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展

孔祥霞, 翟军军, 孙凤莲

Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging

KONG Xiangxia, ZHAI Junjun, SUN Fenglian

机械工程学报 . 2022, (12): 39 -54 . DOI: 10.3901/JME.2022.12.039