特邀专栏:超声加工技术

基于单颗磨粒磨削的超声振动参数与磨削参数匹配性研究

  • 丁凯 ,
  • 傅玉灿 ,
  • 苏宏华 ,
  • 李奇林 ,
  • 雷卫宁
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  • 1. 江苏理工学院机械工程学院 常州 213001;
    2. 南京航空航天大学机电学院 南京 210016
丁凯,男,1983年出生,博士,讲师。主要研究方向为陶瓷及其复合材料的超声辅助加工技术,E-mail:dkcharge@163.com

收稿日期: 2016-12-05

  修回日期: 2017-04-05

  网络出版日期: 2017-10-05

基金资助

江苏省高校自然科学研究(15KJB460010)和常州市应用基础研究计划(CJ20160039)资助项目。

Study on Matching Performance of Ultrasonic Vibration and Grinding Parameters Based on a Single Abrasive Grinding

  • DING Kai ,
  • FU Yucan ,
  • SU Honghua ,
  • LI Qilin ,
  • LEI Weining
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  • 1. School of Mechanical and Electrical Engineering, Jiangsu University of Technology, Changzhou 213001;
    2. College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016

Received date: 2016-12-05

  Revised date: 2017-04-05

  Online published: 2017-10-05

摘要

超声辅助磨削是一种适于加工陶瓷等硬脆材料的先进复合加工技术。超声辅助磨削过程中,超声振动参数与磨削用量的匹配性决定了超声振动作用对磨削过程的影响程度,目前尚缺乏深入的研究。针对这一问题,采用单颗磨粒工具对SiC陶瓷工件抛光表面进行超声辅助磨削及普通磨削试验,通过单颗磨粒磨削力、力比、磨削划痕形貌的对比,分析超声振动作用对磨削过程的影响随磨削用量变化的规律。结果表明,相同条件下单颗磨粒超声辅助磨削的磨削力与力比均小于普通磨削时;磨削用量较小时,单颗磨粒超声辅助磨削划痕形貌呈明显的锤击作用及断续磨削特征。随磨削用量的增大,超声辅助磨削过程中的锤击作用显著弱化,断续磨削特征趋于消失,两种方法之间的磨削力差异减小,即超声振动参数与磨削用量的匹配性变差。

本文引用格式

丁凯 , 傅玉灿 , 苏宏华 , 李奇林 , 雷卫宁 . 基于单颗磨粒磨削的超声振动参数与磨削参数匹配性研究[J]. 机械工程学报, 2017 , 53(19) : 59 -65 . DOI: 10.3901/JME.2017.19.059

Abstract

Ultrasonic assisted grinding (UAG) is an outstanding combined processing technology suitable to machine hard brittle materials such as advanced ceramics. During UAG, the effect of ultrasonic vibration on grinding process is determined by matching performance of ultrasonic vibration and grinding parameters. However, it is still lack of deep study. In response to this problem, a single abrasive tool is adopted to conduct UAG and conventional grinding (CG) tests on polished surface of SiC. Through comparison of grinding force, grinding force ratio and scratch morphology, the effect of ultrasonic vibration on grinding process along with changing grinding parameters is analyzed. The results show that the grinding force and grinding force ratio produced by UAG are lower than those produced by CG under the same conditions. In addition, the grinding scratch morphology produced by the single abrasive presents significant hammering and intermittent characteristics when grinding parameters are low. However, the hammering is weakened evidently and intermittent grinding tends to disappear with increasing grinding parameters. Accordingly, the difference of grinding force between UAG and CG decreases significantly, i.e., the matching performance between ultrasonic vibration and grinding parameters get worse.

参考文献

[1] OLIVEIRA J F G,SILVA E J,GUO C,et al. Industrial challenges in grinding[J]. CIRP Annals-Manufacturing Technology,2009,58(2):663-680.
[2] CHEN H F,TANG J Y. A model for prediction of surface roughness in ultrasonic-assisted grinding[J]. International Journal of Advanced Manufacturing Technology,2015,7(1):643-651.
[3] ZAHEDI A,TAWAKOLI T,AKBARI J. Energy aspects and workpiece surface characteristics in ultrasonic-assisted cylindrical grinding of alumina-zirconia ceramics[J]. Journal of Machine Tools & Manufacture,2015,90:16-28.
[4] LI Z C,JIAO Y,DEINES T W,et al. Rotary ultrasonic machining of ceramic matrix composites:Feasibility study and designed experiments[J]. International Journal of Machine Tools & Manufacture,2005,45(12):1402-1411.
[5] LIU J,ZHANG D Y,QIN L G,et al. Feasibility study of the rotary ultrasonic elliptical machining of carbon fiber reinforced plastics (CFRP)[J]. International Journal of Machine Tools & Manufacture,2012,53(1):141-150.
[6] 梁志强,王西彬,吴勇波,等. 超声振动辅助磨削技术的现状与新进展[J]. 兵工学报,2010,31(11):1530-1535. LIANG Zhiqiang,WANG Xibin,WU Yongbo,et al. Status and progress of ultrasonic assisted grinding technique[J]. Acta Armamentarii,2010,31(11):1530-1535.
[7] 梁志强,王西彬,吴勇波,等. 单晶硅二维超声振动辅助磨削技术的实现[J]. 机械工程学报,2010,46(13):192-198. LIANG Zhiqiang,WANG Xibin,WU Yongbo,et al. Development of a two-dimensional ultrasonic vibration assisted grinding technique of monocrystal silicon[J]. Journal of Mechanical Engineering,2010,46(13):192-198.
[8] MULT H C,SPUR G,HOLL S E. Ultrasonic assisted grinding of ceramics[J]. Journal of Materials Processing Technology,1996,62(4):287-293.
[9] LIANG Z Q,WU Y B,WANG X B,et al. A new two-dimensional ultrasonic assisted grinding (2D-UAG) method and its fundamental performance in monocrystal silicon machining[J]. International Journal of Machine Tools & Manufacture,2010,50(8):728-736.
[10] DING K,FU Y C,SU H H,et al. Wear of diamond grinding wheel in ultrasonic assisted grinding of silicon carbide[J]. International Journal of Advanced Manufacturing Technology,2014,71(9):1929-1938.
[11] WANG Y,LIN B,WANG S L,et al. Study on the system matching of ultrasonic assisted grinding of hard and brittle materials processing[J]. International Journal of Machine Tools & Manufacture,2014,77:66-73.
[12] WANG Y,LIN B,ZHANG X F. Research on the system matching model in ultrasonic vibration-assisted grinding[J]. International Journal of Advanced Manufacturing Technology,2014,70(1):449-458.
[13] CAO J G,WU Y B,LI J Y,et al. A grinding force model for ultrasonic assisted internal grinding (UAIG) of SiC ceramics[J]. International Journal of Advanced Manufacturing Technology,2015,81(5):875-885.
[14] DING K,FU Y C,SU H H,et al. Experimental studies on matching performance of grinding and vibration parameters in ultrasonic assisted grinding of SiC ceramics[J]. International Journal of Advanced Manufacturing Technology,2017,88(9-12):2527-2535.
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