硬脆晶体材料，如SiC、Ge和Si等，由于其临界切削深度极小，常规加工方法很难实现塑性模式加工，研究横向超声振动金刚石线锯对硬脆材料锯切力和临界切削深度的影响有重要意义。在研究线锯受迫振动的基础上，分析金刚石线锯在横向超声波激励下柔性旋转点切割硬脆材料的条件；用特征函数对超声激励下金刚石线锯的振动切割状态进行表征；应用磨削理论建立了单颗金刚石磨粒切割硬脆材料的力学模型；推导出超声振动激励下金刚石线锯锯切硬脆材料临界切削深度的计算公式。以单晶SiC为对象，进行了超声振动线锯切割和普通线锯切割对比试验。结果表明相同条件下，超声振动线锯切割SiC的锯切力比普通线锯的锯切力减少22.4%～64.2%，临界切削深度增加1倍，晶片表面粗糙度有明显的改善。试验结果与理论分析具有良好的一致性。
李伦
,
李淑娟
,
汤奥斐
,
李言
. 横向超声振动对金刚石线锯切割硬脆材料锯切力及临界切削深度的影响[J]. 机械工程学报, 2016
, 52(3)
: 187
-196
.
DOI: 10.3901/JME.2016.03.187
The hard and brittle materials, such as SiC, Ge and Si, are very difficult to cut at ductile mode by conventional machining, because of a extremely small critical cutting depth. Influence of diamond wiresaw excited by transverse ultrasonic vibration on cutting force and critical cutting depth of hard and brittle materials is crucial. Based on analyzing forced vibration of wiresaw, the required conditions that meet the hard and brittle materials rotary cutting at a point in flexible mode by transversely vibrating diamond wiresaw is analyzed and obtained. The characteristic function is used to describe the cutting states of hard and brittle materials cut by transversely vibrating wiresaw. Applying grinding theory, the mechanics model of hard and brittle materials cut by single diamond abrasive particle is established. The formula calculating critical cutting depth of hard and brittle materials cut by transversely vibrating diamond wiresaw is deduced. Comparative experiment of cutting SiC crystals by ultrasonic vibration wiresaw and conventional wiresaw is conducted. The experimental result shows that the cutting force in vibrating wiresaw cutting decreases 22.4%～64.2% than that in conventional wiresaw cutting under the same machining conditions. The critical cutting depth of SiC monocrystals in vibrating wiresaw cutting is double than that in conventional wiresaw cutting. The surface roughness of wafers is improved obviously. Experimental results is consistency with the theoretical analysis.
[1] ZHOU M. Brittle-ductile transition in the diamond cutting of glasses with the aid of ultrasonic vibration[J]. Journal of Materials Processing Technology，2002，121：243-251.
[2] YAN J，YOSHINO M，KURIAGAWA T，et al. On the ductile mach-ining of silicon for micro electro-mechanical systems (MEES)，opto-electronic and optical applications[J]. Materials Science and Engineering A，2001，297(1-2)：230-234.
[3] VENKATESH V C，INASAKI I，TOENSHOF H K，et al. Observations on polishing and ultra-precision machining of semiconductor substrate materials[J]. CIRP Annals Manufacturing Technology，1995，44(2)：611-618.
[4] SCOTT C G，DANYLUK S. Examination of silicon wear debris generated in a linear scratch test[J]. Wear，1992 (152)：183-185.
[5] LI X P，CAI M，RAHMAN M，et al. Study of the upper
bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer[J]. Int.J. Adv. Manuf. Technol.， 2010(48)：993-999.
[6] CAI M B，LI X P，RAHMAN M. High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer[J]. Proc. IMechE，Part B：J. Eng. Manuf.，2007，221(10)：1511-1519.
[7] LIU K，LI X P，RAHMAN M，et al. Study of the effect of tool cutting edge radius on ductile cutting of silicon wafers[J]. Int. J. Adv. Manuf. Technol.，2007(33)：875-884.
[8] YAN J，ASAMI T，HARADA H，et al. Fundamental investigation of subsurface damage in single cry-stalline silicon by diamond machining[J]. Precis. Eng.，2009(33)：378-386.
[9] WANG J J ，LIAO Y Y. Critical depth of cut and specific cutting energy of a microscribing process for hard and brittle materials[J]. ASME J. Eng. Mater. Technol.，2008 (130)：011002.
[10] SHIBATA T，FUJII S，EIJI M，et al. Turning mechanism of single-crystal silicon[J]. Prec. Eng，1996(18)：129-137.
[11] GOGOTSI Y，ZHOU G，KU S，et al. Raman microspectroscopy analysis of pressure-induced metallization in scratching of silicon[J]. Semicond. Sci. Technol.，2001，16(5)：345-352.
[12] MORRIS J C，CALLAHAN D L. The extent of phase transformation in silicon hardness indentations[J]. J. Mater. Res.，1994，9(11)：2907-2913.
[13] BLACK P N，SCATTEERGOOD R O. Ductile-regime machining of germanium and silicon[J]. J. A. M. Ceram. Soc.，1990，73(4)：949-957.
[14] YOSHINO M，SIVANANDAM A，KINOUCHI Y，et al. Critical depth of hard brittle materials on nano plastic forming[J]. Journal of Advanced Mechanical Design，Systems，and Manufacturing，2008，1(2)：59-70.
[15] BIFANO T G，DOW T A，SCATTERGOOD R O. Ductile-regime grinding：A new technology for machining brittle materials[J]. ASME J. Eng. Ind.，1991，113(2)：184-189.
[16] MASAHIKO Y，TAKAYUKI A，TAKAHIRO S. Scratching test of hard-brittle materials under high hydrostatic pressure[J]. Journal of Manufacturing Science and Engineering，2001，3(123)：231-239.
[17] SEOUNG H L. Analysis of ductile mode and brittle transition of AFM nanomachining of silicon[J]. International Journal of Machine Tools & Manufacture， 2012，61：71-79.
[18] WU Hao，SHREYES N. MELKOTE. Study of ductile-to-brittle transition in single grit diamond scribing of silicon：Application to wire sawing of silicon wafers [J]. Journal of Engineering Materials and Technology，2012，10(134)：(041011)1-8.
[19] JOHN P，GAO Wei，YASUTO K. Ductile regime nano-machining of single-crystal silicon carbide[J]. Journal of Manufacturing Science and Engineering， 2005，8(127)：522-532.
[20] 张辽远，贾春德，吕玉山. 电镀金刚石线锯的超声纵振动切割加工方法[J]. 兵工学报，2006，27(5)：899-902. ZHANG Liaoyuan，JIA Chunde，Lü Yushan. A machining method on electroplated diamond wire saw with ultrasonic vibration[J]. Acta Armamentarii，2006，27(5)：899-902.
[21] 张辽远. 电镀金刚石线锯超声波切割试验装置的研制和加工机理的研究[D]. 长春：长春理工大学，2007. ZHANG Liaoyuan. Research of processing principle and development of experiment setup for electro-plated diamond wire saw with ultrasonic vibration[D]. Changchun：Changchun University of Science and Technology，2007.
[22] LI Shujuan，ZHANG Jie，WAN Bo，et al. The force theoretical analysis and experiment for wire saw with UVM cutting SiC monocrystal[J]. Applied Mechanics and Materials，2012(117-119)：1728-1735.
[23] LAWS B R ，EVENS A G. A model for crack in initiation in elastic/plastic indentation fields[J]. Journal of Materials Science，1977，12(2)：2195-2199.
[24] 马春翔，胡德金. 超声波椭圆振动切割技术[J]. 机械工程学报，2003，39(12)：67-70. MA Chunxiang，HU Dejin. Ultrasonic elliptical vibration cutting[J]. Chinese Journal of Mechanical Engineering， 2003，39(12)：67-70.
[25] 李伦，李淑娟，汤奥斐，等. 超声横向激励下轴向运动金刚石线锯振动切割分析[J]. 兵工学报，2014，35(10)： 1651-1658. LI Lun，LI Shujuan，TANG Aofei，et al. Vibration cutting analysis of axially moving diamond wire saw excited by transverse ultrasonic wave[J]. Acta Armamentarii，2014，35(10)：1651-1658.
[26] 李力均，付杰才. 磨削力的数学模型的研究[J]. 机械工程学报，1981，17(4)：31-41. LI Lijun，FU Jiecai. A study of grinding force mathematical model[J]. Chinese Journal of Mechanical Engineering，1981，17(4)：31-41.
[27] 孟剑峰. 环形电镀金刚石线锯加工技术及加工质量研究[D]. 济南：山东大学，2006. MENG Jianfeng. Research on processing technology of endless diamond wire saw and processing quality[D]. Jinan：Shandong University，2006.
[28] 任敬心，华定安. 磨削原理[M]. 北京：电子工业出版社，2011. REN Jingxin，HUA Dingan. Grinding principle[M]. Beijing：Electronics Industry Press，2011.
[29] 陈明君，董申. 硬脆材料超精密磨削时脆塑转变临界条 件的研究[J]. 高技术通讯，2000(2)：64-67. CHEN Mingjun，DONG Shen. Study on critical condition of brittle-ductile transition of brittle materials of ultra-precision grinding[J]. Chinese High Technology Letters，2000(2)：64-67.
[30] SAURAV G，LUO Xichun，PAUL C. Brittle-ductile transition during diamond turning of single crystal carbide [J]. International Journal of Machine Tools and Manufacture，2013，65(10)：15-21.
[31] 张承龙，冯平法，吴志军，等. 旋转超声钻削的切削力数模型及试验研究[J]. 机械工程学报，2011，47(15)：149-155. ZHANG Chenglong，FENG Pingfa，WU Zhijun，et al. Mathematical modeling and experimental research for cutting force in rotary ultrasonic drilling[J]. Journal of Mechanical Engineering，2011，47(15)：149-155.
