The rapid solidification microstructure characteristic and electrical property of Co-Cu-Pb ternary immiscible alloy ribbon are investigated by using the rapid solidification with a single roller experimental apparatus. Through coupled the melt heat conduct equation and Navier-Stokes equation, the cooling rates are calculated theoretically. The results show that:Under rapid solidification conditions, the microstructure of alloys ribbons are consists of Co(Cu) phase dendrite and Pb-rich phase mainly distributed in dendrite boundary. With the rise of cooling rate, the size of Co(Cu) phase dendrite is decreased and its microstructure is remarkably refined. A small quantity of fine Pb phase precipitates inside dendrite branch with the rise of Pb content. The uniformity of the solidified microstructure is improved. With the increase of cooling rate, the electron scattering sources are decreased and the free electron scattering effect is weakened, which resulting in the decreasing of alloy electrical resistivity. And with Pb content increasing, the number of conductive effective charge is reduced, resulting in the increasing of alloy electrical resistivity. Rapid solidification could effectively improve the solidified microstructure uniformity and electrical properties of Co-Cu-Pb alloy ribbon.
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