为了提高等温容器的等温性能，基于拓扑方法将内部细铜丝的分布对强化容器壁向中心导热的影响进行研究。建立导热模型，计算在均匀填充下横截面上的温度场以及容器中心温度。在容器壁温度、中心初始温度和细铜丝平均孔隙率一定的情况下，导热时间15 s，以中心温度最高为优化目标，分别采用线性变密度填充法和自适应成长法优化铜丝分布。两种优化结果的中心温度与均匀填充相比分别提高了0.6 ℃和2.62 ℃，并且得到了相应的铜丝分布曲线。将等温容器内部的铜丝根据优化结果进行分层填充后进行试验验证，先用导热试验说明改变细铜丝分布可以强化容器壁向中心的导热，接着用等温容器放气试验例证了该填充方案能够有效提高等温容器的等温性能。

In order to improve the isothermal performance of isothermal chamber,the influence of the distribution of thin copper wire on the heat conduction enhancement from the wall to internal based on topological methods is studied. The heat conduction model is established,and the temperature fields and the center temperature are calculated under the condition that the copper wire is stuffed uniformly. Under the circumstance that the temperature of the container wall,the initial temperature in the center and the average stuffed density of thin copper wire are certain,taking the maximum of the center temperature as the optimization objective after 15 s heat conduction,the linear variable density filling method and the adaptive growth method are used respectively to optimize the distribution of copper wire. Compared with the uniformly filled,the results of the center temperature are increased 0.6 ℃ and 2.62 ℃ respectively,moreover the corresponding copper wire porosity distribution curves are obtained. The copper wire in the isothermal chamber is layered filled based on the optimized results and the verification experiments are carried out. From the experiment results,it is verified that changing the distribution of copper wire could enhance the heat conduction from the wall to internal and the filling scheme could improve the isothermal performance of isothermal isothermal.