BGA无铅焊点再流焊焊后残余应力分析与优化

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机械工程学报 ›› 2020, Vol. 56 ›› Issue (10) : 86-94. DOI: 10.3901/JME.2020.10.086

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Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2020, 56(10): 86-94 https://doi.org/10.3901/JME.2020.10.086

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 56(10): 86-94 https://doi.org/10.3901/JME.2020.10.086

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