纳米铜银核壳焊膏脉冲电流快速烧结连接铜基板研究

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机械工程学报 ›› 2019, Vol. 55 ›› Issue (24) : 51-56. DOI: 10.3901/JME.2019.24.051

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Rapid Sintering of Nano Copper-Silver Core-Shell Paste and Interconnection of Copper Substrates by Pulse Current

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2019, 55(24): 51-56 https://doi.org/10.3901/JME.2019.24.051

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 55(24): 51-56 https://doi.org/10.3901/JME.2019.24.051

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