Enhanced ablation efficiency for silicon by femtosecond laser microprocessing with GHz bursts in MHz bursts(BiBurst)

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极端制造（英文版） ›› 2022, Vol. 4 ›› Issue (1) : 15103-015103. DOI: 10.1088/2631-7990/ac466e

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Enhanced ablation efficiency for silicon by femtosecond laser microprocessing with GHz bursts in MHz bursts(BiBurst)

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2022, 4(1): 15103-015103 https://doi.org/10.1088/2631-7990/ac466e

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 4(1): 15103-015103 https://doi.org/10.1088/2631-7990/ac466e

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