β-Sn晶粒取向及温度对Cu/SAC305/Cu微焊点时效界面反应的影响

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焊接学报 ›› 2022, Vol. 43 ›› Issue (4) : 32-41. DOI: 10.12073/j.hjxb.20210930003

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Effects of β-Sn grain orientation and temperature on the interfacial reaction in Cu/SAC305/Cu micro solder joints during aging

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2022, 43(4): 32-41 https://doi.org/10.12073/j.hjxb.20210930003

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 43(4): 32-41 https://doi.org/10.12073/j.hjxb.20210930003

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