Sn3.0Ag0.5Cu/Cu回流焊点界面化合物尺寸分布特征及生长机制

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焊接学报 ›› 2022, Vol. 43 ›› Issue (4) : 61-67. DOI: 10.12073/j.hjxb.20210915001

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Size distribution and growth mechanism of interfacial intermetallic compounds in Sn3.0Ag0.5Cu/Cu reflow solder joints

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2022, 43(4): 61-67 https://doi.org/10.12073/j.hjxb.20210915001

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 43(4): 61-67 https://doi.org/10.12073/j.hjxb.20210915001

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