FCBGA器件SnAgCu焊点的热冲击可靠性分析

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焊接学报 ›› 2019, Vol. 40 ›› Issue (9) : 39-42. DOI: 10.12073/j.hjxb.2019400232

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Reliability analysis of thermal shock for SnAgCu solder joints of FCBGA devices

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2019, 40(9): 39-42 https://doi.org/10.12073/j.hjxb.2019400232

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 40(9): 39-42 https://doi.org/10.12073/j.hjxb.2019400232

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